901ACS™Wafer Size: 3", 100mm – 150mm
The Tegal 901ACS™ is the market leader in non-critical silicon nitride and photoresist trim processing for the semiconductor industry. The wide gap RF diode reactor is ideally suited to low temperature plasma etch for delicate organic materials and damage sensitive devices without the complication of wafer clamps or electrostatics chucks. Applications for the 901ACS serve the traditional CMOS and Bipolar silicon semiconductor industry in addition to GaAs, InP and SiGe compound semiconductors; MEMS; advanced packaging; thin film head; and Bio-Chip nanotechnology.
901ACS™ and 903ACS™ are trademarks of Tegal Corporation