6520 HRe¯™Wafer Size: 100mm – 200mm
The Tegal 6520 HRe¯™ is a high-density CCP plasma etch tool featuring dual-frequency RF power application and magnetic plasma confinement. Typical applications for the semiconductor industry include sub-micron aluminum alloy interconnect stack etch and anisotropic thick (>2 micron) aluminum alloy interconnect etch. Typical applications for the telecommunications industry include HBT/HEMT gate mesa and recess etch. With the 6520 HRe¯ product, Tegal also introduced its patented Rinse-Strip-Rinse™ (RSR) process capability. A key feature of Tegal's RSR technology is its ability to minimize the corrosive damage and eliminate the residues generally associated with etching aluminum and iron based metals.
HRe¯™and Spectra™ are trademarks of Tegal Corporation