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The Blue Shirt Group
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TEGAL RECEIVES ORDER FOR PRONOVA™ DRIE SYSTEM
First-time Tegal customer orders third-generation ICP source for 200mm DRIE applications
TOKYO, Japan and PETALUMA, Calif., July 28, 2009—Tegal Corporation, (Nasdaq: TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it received an order for a Tegal DRIE 200 system equipped with the ProNova™ third-generation high-density Inductively Coupled Plasma (ICP) reactor. This commercial order for the Tegal ProNova reactor is from a first-time Tegal customer in the EU, who will use the Deep Reactive Ion Etching (DRIE) tool to perform innovative research for high-performance microelectronics on 200mm wafers.
In a competitive evaluation, the new ProNova ICP source demonstrated higher etch rates, improved etch depth uniformity, better etch tilt angle uniformity, and higher yields than did standard ICP sources for DRIE applications. These significant advantages over standard ICP sources were particularly evident on larger diameter wafers, in this case 200mm wafers, with the end results being wider process windows and better tool productivity, both items being critical to creating rapid cycles of learning and performing efficient development and research.
“When we began our DRIE business in September 2008 we said we would work to demonstrate and sell production-worthy silicon DRIE tools for MEMS applications to new customers and to existing Tegal customers, and we said we would work together with our customers to develop the advanced DRIE processes needed for new MEMS and 3D IC applications,” said Thomas Mika, Tegal’s President and CEO. “The commercial launch of the ProNova ICP source today, together with this order for a Tegal DRIE 200 system equipped with a ProNova reactor, confirms that Tegal offers customers the best combination of leading-edge technology, customer support, and production-proven systems for 200mm MEMS and 3D IC applications.”
The ProNova ICP source is available on Tegal 110, 200, 3200, and 4200 DRIE Wafer Processing Systems. ProNova is also compatible as a retrofit with Tegal and AMMS DRIE systems already in the field, and ProNova supports SHARP – Tegal’s Super High Aspect Ratio Process, achieving etched feature aspect ratios of > 100:1 in production environments.
In support of the ProNova launch, Tegal is exhibiting at Micromachine/MEMS 2009, Tokyo Big Sight,
Except for historical information, matters discussed in this news release contain forward-looking statements within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange Act. Forward-looking statements, which are based on assumptions and describe our future plans, strategies and expectations, are generally identifiable by the use of the words "anticipate," "believe," "estimate," "expect," "intend," "project" or similar expressions. These forward-looking statements are subject to risks, uncertainties and assumptions about the Company including, but not limited to industry conditions, economic conditions, acceptance of new technologies and market acceptance of the Company's products and services. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by the cautionary statements in this paragraph. For a further discussion of these risks and uncertainties, please refer to the Company's periodic filings with the Securities and Exchange Commission.
About Tegal Corporation
Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices found in products like smart phones, networking gear, solid-state lighting, and digital imaging. The Company’s plasma etch and deposition tools enable sophisticated manufacturing techniques, such as 3D interconnect structures formed by intricate silicon etch, also known as Deep Reactive Ion Etching (DRIE). Tegal combines proven expertise with practical system strategies to deliver application-specific solutions that are robust and reliable, and deliver exceptional process quality and high yields at a lower overall cost of ownership. Headquartered in