Advanced power device fabrication is increasingly using ultra-thin wafers— as little as 50µm thick—in order to realize the enhanced performance and yield metrics the market demands. While thinner wafers enable improved device performance, the handling and processing of ultra-thin wafers introduces a unique set of challenges. In order to reap the benefits of these wafers, specialized handling systems and stress control technologies are required. 

Tegal’s Endeavor AT™ physical vapor deposition (PVD) system combines a “sputter-up” configuration, an optimized pre-clean process module and sophisticated stress control technology to meet the challenge.

Endeavor AT™ is a trademark of Tegal Corporation